Light emitting device package and method of manufacturing the same
US8587010B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2011 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | Mar 22, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/858
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a light emitting device package including: a plurality of lead frames disposed to be separated from one another; at least one light emitting device mounted on the lead frames and electrically connected to the lead frames through a bonding wire provided on a wire bonding pad, the wire bonding pad being disposed on the same surface as a light emission surface provided as an upper surface of the light emitting device; a body part formed to encapsulate and support the wire bonding pad, the bonding wire, the light emitting device and the lead frames, and having a reflective groove formed in an upper surface thereof to expose the light emission surface to the outside therethrough; and a lens part disposed on the body part, to cover the light emitting device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.