Multi-chip and multi-substrate reconstitution based packaging
US8587123B2 · kind B2 · utility
8Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2011 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | Sep 27, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments for multi-chip and multi-substrate reconstitution based packaging are provided. Example packages are formed using substrates from a reconstitution. substrate panel or strip. The reconstitution substrate panel or strip may include known good substrates of same or different material types and/or same of different layer counts and sizes. As such, different combinations of reconstitution substrates and chips can be used within the same package, thereby allowing substrate customization according to semiconductor chip block(s) and types contained in the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.