Method of fabricating a circuit structure
US8590145B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2009 |
| Grant date | Nov 26, 2013 |
| Priority date | — |
| Expiry date | Sep 26, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of fabricating a circuit structure are provided. The fabrication method includes: forming a chip layer, which includes obtaining at least one chip and disposing a structural material around and physically contacting the side surface(s) of each chip in the chip layer. The structural material has an upper surface substantially coplanar with or parallel to an upper surface of each chip and defines at least a portion of a front surface of the chip layer, and has a lower surface substantially coplanar with or parallel to a lower surface of each chip, which defines at least portion of a back surface of the chip layer. The method further includes forming at least one strengthening structure over the back surface of the chip layer. The strengthening structure is formed to strengthen an interface between the chip(s) and the structural material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.