Substrate inductive devices and methods
US8591262B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2010 |
| Grant date | Nov 26, 2013 |
| Priority date | — |
| Expiry date | Sep 3, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49174
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a substrate based inductive device which utilizes inserted conductive pins in combination with plated substrates which replace windings disposed around a magnetically permeable core. In some variations this is accomplished without a header disposed between adjacent substrates while alternative variations utilize a header. In another embodiment, the substrate inductive devices are incorporated into integrated connector modules. Methods of manufacturing and utilizing the aforementioned substrate based inductive devices and integrated connector modules are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.