Sealing structure and method of manufacturing the same
US8592228B2 · kind B2 · utility
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1References
18Claims
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Key dates
| Filing date | Nov 15, 2007 |
| Grant date | Nov 26, 2013 |
| Priority date | — |
| Expiry date | May 1, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0145
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of manufacturing a structure (1100), the method comprising forming a cap element (401) on a substrate (101), removing material (103) of the substrate (101) below the cap element (401) to thereby form a gap (802) between the cap element (401) and the substrate (101), and rearranging material of the cap element (401) and/or of the substrate (101) to thereby merge the cap element (401) and the substrate (101) to bridge the gap (802).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.