Integrated circuit device
US8592831B2 · kind B2 · utility
0Cited by
126References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 26, 2006 |
| Grant date | Nov 26, 2013 |
| Priority date | — |
| Expiry date | Apr 23, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrally packaged optronic integrated circuit device including an integrated circuit die containing at least one of a radiation emitter and radiation receiver and having a transparent packaging layer overlying a surface of the die, the transparent packaging layer having an opaque coating adjacent to edges of the layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.