Semiconductor package having proximity communication signal input terminals and manufacturing methods thereof
US8592982B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2011 |
| Grant date | Nov 26, 2013 |
| Priority date | — |
| Expiry date | Jun 7, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a semiconductor structure. The semiconductor structure includes a plurality of dielectric layers and a plurality of conductive interconnects embedded in the semiconductor structure. The semiconductor structure also includes a plurality of proximity communication signal input terminals. At least one of the plurality of proximity communication signal input terminals includes a first electrode and a second electrode. The first electrode and the second electrode are spaced apart so as to be configured to provide proximity communication through capacitive coupling. The first electrode is exposed proximate to a surface of the semiconductor structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.