Method and apparatus for performing pattern alignment to plurality of dies

US8594824B2 · kind B2 · utility

Assignee

• MICRONIC MYDATA AB · SE

Inventors

• Mikael Wahlsten · Stockholm, SE
• Per Gustafsson · Bjärred, SE

Key dates

• Filing date: Feb 28, 2011
• Grant date: Nov 26, 2013
• Expiry date: Mar 26, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/4679
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A method for patterning a workpiece in a direct write machine in the manufacturing of a multilayer stack, wherein a first circuit pattern comprising patterns for connection points is transformed according to determined fitting tolerances to fit to connection points of a second circuit pattern and to circuit pattern(s) of specific features such as random placed dies, or group of dies, on or in the workpiece. The second layer may be a previously formed layer or a layer to be formed on the same workpiece or on a different workpiece for the stack. Pattern data associated with selected die is transformed into adjusted circuit pattern data using the transformation defined by the transformed positions such that the circuit pattern is fitted to the selected die(s).