Method for processing substrate and method for producing liquid ejection head and substrate for liquid ejection head
US8597529B2 · kind B2 · utility
1Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2009 |
| Grant date | Dec 3, 2013 |
| Priority date | — |
| Expiry date | Aug 23, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1639
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for processing a substrate includes preparing a substrate having a first layer on a first surface side thereof, the first layer having a material capable of suppressing transmission of laser light, processing the substrate with laser light from a second surface that is opposite the first surface of the substrate toward the first surface of the substrate, and allowing the laser light to reach the first layer to form a hole in the substrate, and performing etching of the substrate from the second surface through the hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.