Solvent systems for metals and inks
US8597548B2 · kind B2 · utility
1Cited by
2References
26Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 19, 2007 |
| Grant date | Dec 3, 2013 |
| Priority date | — |
| Expiry date | Sep 3, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/122
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Solvent systems and dispersions including such solvent systems for use in compositions including metals and inks are provided. In certain examples, the solvent systems may be used with capped metal particles to provide a dispersion that may be used to print conductive lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.