Vertical solid-state transducers and solid-state transducer arrays having backside terminals and associated systems and methods

US8598611B2 · kind B2 · utility

Assignee

• Micron Technology, Inc. · US

Inventors

• Vladimir Odnoblyudov · Danville, US
• Martin F. Schubert · Mountain View, US
• Scott D. Schellhammer · Meridian, US
• Jeremy S. Frei · Boise, US

Key dates

• Filing date: Jan 9, 2012
• Grant date: Dec 3, 2013
• Expiry date: Jan 9, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H29/142

Abstract

Solid-state transducers (“SSTs”) and SST arrays having backside contacts are disclosed herein. An SST in accordance with a particular embodiment can include a transducer structure having a first semiconductor material at a first side of the transducer structure, and a second semiconductor material at a second side of the transducer structure. The SST can further include a first contact at the first side and electrically coupled to the first semiconductor material, and a second contact extending from the first side to the second semiconductor material and electrically coupled to the second semiconductor material. A carrier substrate having conductive material can be bonded to the first and second contacts.