Patent · US Active

Power semiconductor module, method for producing a power semiconductor module and a housing element for a power semiconductor module

US8598697B2 · kind B2 · utility

4Cited by

5References

8Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Olaf Kirsch · Erwitte, DE
Peter Kanschat · Soest, DE
Andre Roehrig · Kamen, DE
Thilo Stolze · Arnsberg, DE

Key dates

Filing date	Jul 27, 2011
Grant date	Dec 3, 2013
Priority date	—
Expiry date	Dec 5, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01R13/415
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A power semiconductor module includes a housing element into which one or more connecting lugs are inserted. Each connecting lug has a foot region on the topside of which one or more bonding connections can be produced. In order to fix the foot regions, press-on elements are provided, which press against the end of the connecting lug.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.