Probe, electronic device test apparatus, and method of producing the same
US8598902B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 12, 2009 |
| Grant date | Dec 3, 2013 |
| Priority date | — |
| Expiry date | Apr 19, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R3/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe comprises: a membrane having a bump which contacts an input/output terminal of an IC device built into a semiconductor wafer under test; a pitch conversion board having a bottom surface on which a first terminal is provided and a top surface on which a second terminal connected to the first terminal is provided; a circuit board which is electrically connected to a test head and has a third terminal; a first anisotropic conductive rubber member having a first conductor part which electrically connects the bump of the membrane and the first terminal of the pitch conversion board; and a second anisotropic conductive rubber member having a second conductor part which electrically connects the second terminal of the pitch conversion board and the third terminal of the circuit board, and the second conductor parts are provided on the whole of the second anisotropic conductive rubber member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.