Heat sink retaining structure for light emitting device board assemblies, and methods
US8602597B2 · kind B2 · utility
4Cited by
11References
45Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2010 |
| Grant date | Dec 10, 2013 |
| Priority date | — |
| Expiry date | Mar 30, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/7007
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An assembly includes a board, a heat sink, one or more retainers, and/or one or more light-emitting diode packages. The board includes a face surface, a rear surface opposite the face surface, and side edges. The one or more retainers are configured to secure the board to the heat sink. One or more light-emitting diode packages can be secured to the board for creating a light-emitting device assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.