Semiconductor manufacturing process modules
US8602716B2 · kind B2 · utility
14Cited by
57References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2007 |
| Grant date | Dec 10, 2013 |
| Priority date | — |
| Expiry date | Dec 24, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6719
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is provided where the method includes configuring a plurality of robots so that a wafer can be handed off between neighboring robots, and disposing a plurality of sensors so that a robotic arm-relative position of a wafer that is transported by a robot is determined from sensor outputs by moving the wafer through a retract, rotate, and extend path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.