Polishing pad and a method for manufacturing the same
US8602846B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2012 |
| Grant date | Dec 10, 2013 |
| Priority date | — |
| Expiry date | Jul 18, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D11/001
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad of excellent durability and adhesion between the polishing layer and the base material layer includes a polishing layer arranged on a base material layer, wherein the polishing layer includes a thermosetting polyurethane foam having roughly spherical interconnected cells having an average cell diameter of 20 to 300 μm. The polyurethane foam includes an isocyanate component and an active hydrogen-containing compound as starting material components, and the active hydrogen-containing compound includes 30 to 85% by weight of a high-molecular-weight polyol having 2 to 4 functional groups and a hydroxyl value of 20 to 100 mg KOH/g.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.