Patent · US Active

Method of processing a contact pad

US8603910B2 · kind B2 · utility

2Cited by

0References

37Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Marco Koitz · Villach, AT
Guenter Zieger · Villach, AT
Christian Krenn · Pernegg, AT
Franz Kleinbichler · Villach, AT
Guenther Zoth · Regensburg, DE
Karl Mayer · Villach, AT

Key dates

Filing date	Jan 13, 2012
Grant date	Dec 10, 2013
Priority date	—
Expiry date	Apr 7, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In various embodiments, a method of processing a contact pad may include providing a contact pad, a topmost layer of the contact pad containing aluminum or an aluminum alloy, at least part of the topmost layer of the contact pad being exposed; subjecting the contact pad to a thermally activated atmosphere containing water or reactive components of water.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.