Patent · US Active

Detecting defects on a wafer

US8605275B2 · kind B2 · utility

18Cited by

2References

20Claims

0Family size

Assignee

KLA-TENCOR CORPORATION · US

Inventors

Lu Chen · Sunnyvale, US
Qiang Zhang · Dalian, CN

Key dates

Filing date	Jul 28, 2011
Grant date	Dec 10, 2013
Priority date	—
Expiry date	Jul 28, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/12
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Systems and methods for detecting defects on a wafer are provided. One method includes combining first image data and second image data, generated using different output generated using different values for focus of an inspection system, corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer and detecting defects on the wafer using the additional image data.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.