Copper electrodeposition in microelectronics
US8608933B2 · kind B2 · utility
1Cited by
11References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2011 |
| Grant date | Dec 17, 2013 |
| Priority date | — |
| Expiry date | Aug 22, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76879
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and composition for electroplating Cu onto a substrate in the manufacture of a microelectronic device. The plating composition comprises an electrolytic solution containing a source of Cu ions and a substituted pyridyl polymer compound for leveling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.