Inventor · Northford, CT, US

Xuan Lin

24Patents
9h-index
28Co-inventors
75Inventor score

Filing activity: Sep 12, 1997 → Mar 8, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US7670950B2 Copper metallization of through silicon via Electricity 33 Active
US7303992B2 Copper electrodeposition in microelectronics Electricity 17 Expired
US6818116B2 Additive-assisted cerium-based electrolytic coating process for corrosion protection of aluminum alloys Chemistry; Metallurgy 16 Expired
US5932083A Electrodeposition of cerium-based coatings for corrosion protection of aluminum alloys Chemistry; Metallurgy 16 Expired
US7998859B2 Surface preparation process for damascene copper deposition Electricity 15 Active
US7241371B2 Additive-assisted, cerium-based, corrosion-resistant e-coating Chemistry; Metallurgy 14 Expired
US7316772B2 Defect reduction in electrodeposited copper for semiconductor applications Electricity 11 Expired
US7968455B2 Copper deposition for filling features in manufacture of microelectronic devices Electricity 10 Active
US7048807B2 Cerium-based spontaneous coating process for corrosion protection of aluminum alloys Chemistry; Metallurgy 9 Expired
US7815786B2 Copper electrodeposition in microelectronics Electricity 5 Active
US8388824B2 Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers Electricity 5 Active
US8771495B2 Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers Electricity 3 Active
US9222188B2 Defect reduction in electrodeposited copper for semiconductor applications Electricity 2 Active
US11630210B2 Method for creating occupancy grid map and processing apparatus Physics 2 Active
US8608933B2 Copper electrodeposition in microelectronics Electricity 1 Active
US10339895B2 Brightness compensation circuitry, and display device including the same Physics 1 Active
US8002962B2 Copper electrodeposition in microelectronics Electricity 1 Active
USRE49202E1 Copper electrodeposition in microelectronics General 0 Active
US11315486B1 Image processing circuit and image processing method with overdriving illumination element Physics 0 Active
US9613858B2 Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers Electricity 0 Active
US10541140B2 Process for filling vias in the microelectronics Electricity 0 Active
US9493884B2 Copper electrodeposition in microelectronics Electricity 0 Active
US12164032B2 Method for creating occupancy grid map and processing apparatus Physics 0 Active
US10221496B2 Copper filling of through silicon vias Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.