Patent · US Active

Metal e-fuse with intermetallic compound programming mechanism and methods of making same

US8610243B2 · kind B2 · utility

1Cited by
12References
24Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 9, 2011
Grant dateDec 17, 2013
Priority date
Expiry dateDec 9, 2031

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Disclosed herein is a metal e-fuse device that employs an intermetallic compound programming mechanism and various methods of making such an e-fuse device. In one example, a device disclosed herein includes a first metal line, a second metal line and a fuse element that is positioned between and conductively coupled to each of the first and second metal lines, wherein the fuse element is adapted to be blown by passing a programming current therethrough, and wherein the fuse element is comprised of a material that is different from a material of construction of at least one of the first and second metal lines.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.