Integrated circuit package with multiple dies and sampled control signals
US8610258B2 · kind B2 · utility
2Cited by
12References
25Claims
0Family size
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Key dates
| Filing date | Dec 2, 2010 |
| Grant date | Dec 17, 2013 |
| Priority date | — |
| Expiry date | Apr 21, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A package includes a first die and a second die, at least one of said first and second dies being a memory. The dies are connected to each other through an interface. The interface is configured to transport both control signals and memory transactions. A sampling circuit samples the control signals before transport on the interface. The sampling circuit is controlled in dependence on at least one quality of service parameter associated with a respective control signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.