Microelectromechanical resonators having resistive heating elements therein configured to provide frequency tuning through convective heating of resonator bodies
US8610336B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2011 |
| Grant date | Dec 17, 2013 |
| Priority date | — |
| Expiry date | Feb 13, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2009/241
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A microelectromechanical resonator includes a resonator body, which is encapsulated within a sealed cavity extending between first and second substrates that are bonded together. The resonator body is anchored to the first substrate by at least a pair of tethers that suspend the resonator body opposite an underlying recess in the first substrate. A resistive heating element is provided, which is configured to indirectly heat the resonator body through convective heating of the cavity. This resistive heating element may be disposed on an inner surface of the second substrate that is exposed to the cavity. The resonator may also include first and second electrical interconnects, which extend through the second substrate and contact respective first and second portions of the resistive heating element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.