Defective-ratio predicting method, defective-ratio predicting program, managing method for semiconductor manufacturing apparatus, and manufacturing method for semiconductor device
US8612811B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2009 |
| Grant date | Dec 17, 2013 |
| Priority date | — |
| Expiry date | Dec 20, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2111/08
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In a managing system for a semiconductor manufacturing apparatus, a predicting unit 121 predicts a characteristic defective ratio and a foreign-substance defective ratio of each process obtains an actual defective ratio of each fail bit mode and a critical area of each process and each fail bit mode, calculates the number of foreign substances of each process by using the actual defective ratio of each fail bit mode and the critical area of each process and each fail bit mode, the fail bit mode being except for an arbitrary fail bit mode, calculates a foreign-substance defective ratio of each process and a foreign-substance defective ratio of each fail bit mode by using the number of foreign substances, and calculates a characteristic defective ratio of the arbitrary fail bit mode based on the foreign-substance defective ratio and actual defective ratio of each fail bit mode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.