Liner-free tungsten contact
US8614106B2 · kind B2 · utility
5Cited by
8References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2011 |
| Grant date | Dec 24, 2013 |
| Priority date | — |
| Expiry date | Nov 18, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A liner-less tungsten contact is formed on a nickel-tungsten silicide with a tungsten rich surface. A tungsten-containing layer is formed using tungsten-containing fluorine-free precursors. The tungsten-containing layer may act as a glue layer for a subsequent nucleation layer or as the nucleation layer. The tungsten plug is formed by standard processes. The result is a liner-less tungsten contact with low resistivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.