Package interface plate for package isolation structures
US8614491B2 · kind B2 · utility
1Cited by
11References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2010 |
| Grant date | Dec 24, 2013 |
| Priority date | — |
| Expiry date | Oct 25, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B7/0048
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A package assembly comprises a package base, a sensor die, an isolation plate, and a package interface plate. The isolation plate is bonded to the sensor die and has a plurality of flexible beams. Each flexible beam is configured to deflect under stress such that effects on the sensor die of a thermal mismatch between the package base and the sensor die are reduced. The package interface plate is bonded to the isolation plate and the package base. The package interface plate is configured to limit the maximum distance each flexible beam is able to deflect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.