Organic deposition apparatus and method of depositing organic substance using the same
US8617314B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2008 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Apr 2, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An organic material deposition system and method are provided. The organic material deposition apparatus may include a chamber having a processing space formed therein, a source supply device that generates an organic source and injects and diffuses the organic source into the processing space through a shower head provided in the processing space. The substrate is supported by a stage device that moves the substrate upward and downward within the processing space to adjust a distance between the substrate and the shower head. A pumping port provided at an upper positioned at an upper portion of the processing space provides a vacuum exhaust path that directs flow through the processing space toward the stage device. This allows an organic thin film with a uniform thickness to be deposited using an apparatus with a relatively simple configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.