Patent · US Active

Method for producing a substrate including a step of thinning with stop when a porous zone is detected

US8617908B2 · kind B2 · utility

3Cited by

5References

23Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Frederic Gaillard · Grenoble, FR
Fabrice Nemouchi · Moirans, FR

Key dates

Filing date	Mar 10, 2011
Grant date	Dec 31, 2013
Priority date	—
Expiry date	Mar 10, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/12
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for producing a substrate, the method including: forming a porous zone in an inner layer of the substrate; progressively thinning a thickness of the substrate towards the inner layer including the porous zone; completing the progressively thinning by polishing; and controlled stopping of the polishing by detecting the porous zone during the polishing, the detecting including measuring at least one measurable physical parameter admitting a significant variation during a transition between two layers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.