Silicon microphone transducer
US8617960B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2010 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Jun 23, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/692
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A capacitive microphone transducer integrated into an integrated circuit includes a fixed plate and a membrane formed in or above an interconnect region of the integrated circuit. A process of forming an integrated circuit containing a capacitive microphone transducer includes etching access trenches through the fixed plate to a region defined for the back cavity, filling the access trenches with a sacrificial material, and removing a portion of the sacrificial material from a back side of the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.