Apparatus with a wire bond and method of forming the same
US8618420B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2011 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Jun 2, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.