Method of assembly of a semiconductor package for the improvement of the electrical testing yield on the packages so obtained
US8618676B2 · kind B2 · utility
0Cited by
28References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2008 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Jun 2, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of assembly of a semiconductor package includes treating the electrical contacts thereof by the application on the electrical contacts of a chemical composition comprising at least one ionic polar surfactant. A semiconductor package has a coating on the electrical contacts thereof, the coating comprising at least one ionic polar surfactant. A device includes a semiconductor package with electrical contacts on a circuit board, the electrical contacts having a coating that includes an ionic surfactant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.