Electronic package structure
US8619428B2 · kind B2 · utility
1Cited by
12References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2011 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Mar 12, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1327
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.