Endeffectors for handling semiconductor wafers
US8622451B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 24, 2012 |
| Grant date | Jan 7, 2014 |
| Priority date | — |
| Expiry date | Jan 24, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An endeffector for handling wafers at a relatively low temperature is disclosed along with an endeffector for handling wafers at a relatively high temperature. Both endeffectors include a base member and uniquely designed support members that are configured to only contact a wafer at the wafer's edge. Further, the support members have an arcuate shape that generally matches a radius of a semiconductor wafer. More specifically, each support member has a curved wafer contact surface that tapers from a maximum radius at a top surface to a minimum radius at a bottom surface. The endeffectors may also include a wafer detection system. The endeffector for handling wafers at relatively low temperatures may also include a pushing device that is used not only to position a wafer but to hold a wafer on the endeffector during acceleration or deceleration of the endeffector caused by a robot arm attached to the endeffector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.