Probe-card interposer constructed using hexagonal modules
US8622752B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2011 |
| Grant date | Jan 7, 2014 |
| Priority date | — |
| Expiry date | Apr 13, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Apparatus and methods for fabricating an interposer that may be used in testing a large number of electronic circuits or devices in parallel. The interposer may be fabricated from a plurality of modules that may be assembled into a selected shape, such that the assembled modules substantially fill the selected shape, e.g., a circle approximately the size of a semiconductor wafer. The plurality of modules may be formed from a single base shape (e.g., formed from a single injection mold). A portion of the formed modules may be machined into a first machined shape, or first and second machined shapes. The assembled modules may include only the base shape and first machined shape or first and second machined shapes. The limited number of shapes can reduce fabrication costs for an interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.