TDI sensor modules with localized driving and signal processing circuitry for high speed inspection
US8624971B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2009 |
| Grant date | Jan 7, 2014 |
| Priority date | — |
| Expiry date | Nov 6, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N25/71
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An inspection system for inspecting a surface of a wafer/mask/reticle can include a modular array. The modular array can include a plurality of time delay integration (TDI) sensor modules, each TDI sensor module having a TDI sensor and a plurality of localized circuits for driving and processing the TDI sensor. At least one of the localized circuits can control a clock associated with the TDI sensor. At least one light pipe can be used to distribute a source illumination to the plurality of TDI sensor modules. The plurality of TDI sensor modules can be positioned capture a same inspection region or different inspection regions. The plurality of TDI sensor modules can be identical or provide for different integration stages. Spacing of the modules can be arranged to provide 100% coverage of the inspection region in one pass or for fractional coverage requiring two or more passes for complete coverage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.