Method for packaging a microelectromechanical system (MEMS) device
US8627566B2 · kind B2 · utility
1Cited by
16References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2010 |
| Grant date | Jan 14, 2014 |
| Priority date | — |
| Expiry date | Nov 14, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49297
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ceramic header configured to form a portion of an electronic device package includes a mounting portion configured to provide a mounting surface for an electronic device. In addition, the ceramic header includes one or more conductive input-output connectors operable to provide electrical connections from a first surface of the ceramic header to a second surface of the ceramic header. The ceramic header also includes one or more thermally polished surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.