Mark A. Kressley
7Patents
5h-index
19Co-inventors
56Inventor score
Filing activity: Oct 30, 1992 → Apr 1, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6373127B1 | Integrated capacitor on the back of a chip | Electricity | 204 | Expired |
| US5327327A | Three dimensional assembly of integrated circuit chips | Electricity | 71 | Expired |
| US5646068A | Solder bump transfer for microelectronics packaging and assembly | Electricity | 24 | Expired |
| US6600183B1 | Integrated circuit capacitor and memory | Electricity | 18 | Expired |
| US5558554A | Method for fabricating a field emission device anode plate having multiple grooves between anode conductors | Electricity | 6 | Expired |
| US7690106B2 | Ceramic header method | Emerging Cross-Sectional Technologies | 1 | Active |
| US8627566B2 | Method for packaging a microelectromechanical system (MEMS) device | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.