Patent · US Active

Micromechanical sensor element, method for manufacturing a micromechanical sensor element and method for operating a micromechanical sensor element

US8627719B2 · kind B2 · utility

2Cited by

17References

9Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Michael Offenberg · Lörrach, DE
Michael Baus · Bietigheim-Bissingen, DE

Key dates

Filing date	Jul 9, 2009
Grant date	Jan 14, 2014
Priority date	—
Expiry date	Apr 9, 2032

Classification

Technology area (CPC G)Physics
CPC primaryG01P2015/0831
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A micromechanical sensor element includes: a substrate; a first seismic mass suspended from the substrate, which is deflectable from a first rest position by an acceleration acting perpendicularly to a main plane of extension; and a second seismic mass, which is deflectable from a second rest position by the acceleration. At least a partial overlap is provided between the first seismic mass and the second seismic mass perpendicular to the main plane of extension.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.