Method of manufacturing a package substrate
US8628636B2 · kind B2 · utility
0Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2012 |
| Grant date | Jan 14, 2014 |
| Priority date | — |
| Expiry date | Mar 17, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a package substrate. A carrier member is formed on an insulation protection layer on either of two surfaces of a core layer. The package substrate has the carrier member combined with one side thereof, and is prevented from being damaged during transportation or packaging due to reduced thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.