Lee-Sheng Yen
8Patents
1h-index
1Co-inventors
33Inventor score
Filing activity: Jan 11, 2010 → Feb 26, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8987060B2 | Method for making circuit board | Emerging Cross-Sectional Technologies | 3 | Active |
| US8748234B2 | Method for making circuit board | Emerging Cross-Sectional Technologies | 1 | Active |
| US8742567B2 | Circuit board structure and packaging structure comprising the circuit board structure | Emerging Cross-Sectional Technologies | 0 | Active |
| US8698008B2 | Packaging substrate and fabrication method thereof | Emerging Cross-Sectional Technologies | 0 | Active |
| US8836108B2 | Circuit board structure and package structure | Emerging Cross-Sectional Technologies | 0 | Active |
| US9084341B2 | Fabrication method of packaging substrate | Emerging Cross-Sectional Technologies | 0 | Active |
| US8628636B2 | Method of manufacturing a package substrate | Emerging Cross-Sectional Technologies | 0 | Active |
| US8102063B2 | Pad structure with a nano-structured coating film | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.