Charged particle beam masking for laser ablation micromachining
US8629416B2 · kind B2 · utility
5Cited by
18References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2012 |
| Grant date | Jan 14, 2014 |
| Priority date | — |
| Expiry date | May 2, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31749
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An improved method for substrate micromachining. Preferred embodiments of the present invention provide improved methods for the utilization of charged particle beam masking and laser ablation. A combination of the advantages of charged particle beam mask fabrication and ultra short pulse laser ablation are used to significantly reduce substrate processing time and improve lateral resolution and aspect ratio of features machined by laser ablation to preferably smaller than the diffraction limit of the machining laser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.