Patent · US Active

Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires

US8629540B2 · kind B2 · utility

5Cited by

0References

13Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Brian P. Gaucher · Brookfield, US
Duixian Liu · Yorktown Heights, US
Ullrich R. Pfeiffer · Wolfsburg, DE
Thomas Zwick · Leutkirch im Allgäu, DE

Key dates

Filing date	Mar 19, 2012
Grant date	Jan 14, 2014
Priority date	—
Expiry date	Mar 19, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49018
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.