Integrated circuit package with multiple dies and a multiplexed communications interface
US8629544B2 · kind B2 · utility
5Cited by
12References
24Claims
0Family size
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Key dates
| Filing date | Dec 2, 2010 |
| Grant date | Jan 14, 2014 |
| Priority date | — |
| Expiry date | Oct 3, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package includes a first die and a second die, at least one of said first and second dies being a memory. The dies are connected to each other through an interface. The interface is configured to transport both control signals and memory transactions. A multiplexer is provided to multiplex the control signals and memory transactions onto the interface such that a plurality of connections of said interface are shared by the control signals and the memory transactions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.