Method for electron beam induced etching of layers contaminated with gallium
US8632687B2 · kind B2 · utility
14Cited by
26References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2009 |
| Grant date | Jan 21, 2014 |
| Priority date | — |
| Expiry date | Feb 18, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32136
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for electron beam induced etching of a layer contaminated with gallium, with the method steps of providing at least one first halogenated compound as an etching gas at the position at which an electron beam impacts on the layer, and providing at least one second halogenated compound as a precursor gas for removing of the gallium from this position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.