Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith
US8632874B2 · kind B2 · utility
6Cited by
17References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2010 |
| Grant date | Jan 21, 2014 |
| Priority date | — |
| Expiry date | Dec 3, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31931
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.