Sankar Paul
4Patents
2h-index
5Co-inventors
33Inventor score
Filing activity: Feb 13, 2009 → Jul 11, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8632874B2 | Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith | Emerging Cross-Sectional Technologies | 6 | Active |
| US8519273B2 | Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom | Emerging Cross-Sectional Technologies | 3 | Active |
| US8809690B2 | Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof | Emerging Cross-Sectional Technologies | 2 | Active |
| US9918384B2 | Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.