Die bonding process incorporating infrared vision system
US8633441B2 · kind B2 · utility
6Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2009 |
| Grant date | Jan 21, 2014 |
| Priority date | — |
| Expiry date | Jun 1, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of aligning a die when the die is held with a circuit pattern on a first side of the die facing away from an infrared light source, wherein infrared light from the infrared light source is projected onto a second side of the die opposite to the first side such that the infrared light passes through a body of the die. From the second side of the die, an image of the infrared light reflected from the circuit pattern is detected and captured. Thereafter, an alignment of the die from the captured image of the die is determined.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.