Patent · US Active

Thermal vias in an integrated circuit package with an embedded die

US8633597B2 · kind B2 · utility

2Cited by

3References

29Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Fifin Sweeney · San Diego, US
Milind Shah · San Diego, US
Mario Francisco Velez · San Diego, US
Damion B. Gastelum · San Diego, US

Key dates

Filing date	Mar 1, 2010
Grant date	Jan 21, 2014
Priority date	—
Expiry date	Apr 25, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In a multi-module integrated circuit package having a package substrate and package contacts, a die is embedded in the package substrate with thermal vias that couple hotspots on the embedded die to some of the package contacts.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.