Method for a multiple exposure, microlithography projection exposure installation and a projection system
US8634060B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 16, 2010 |
| Grant date | Jan 21, 2014 |
| Priority date | — |
| Expiry date | Sep 1, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70991
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In a method for multiply exposing at least one substrate coated with a photosensitive layer, a first exposure is carried out in accordance with a first set of exposure parameters on a first projection system (17), and a second exposure is carried out in accordance with a second set of exposure parameters on a second projection system (18) spatially separated from the first projection system (17). The projection systems are integrated in a common projection exposure installation (1). The first exposure can be carried out, for example, with an amplitude mask (6), the second exposure with a phase mask (9). The use of a number of projection systems enables multiple exposure that is performed in parallel and is therefore timesaving.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.