Surface measurement instrument and method
US8635783B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2009 |
| Grant date | Jan 28, 2014 |
| Priority date | — |
| Expiry date | Mar 7, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B21/042
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of determining a correction parameter for use in effecting alignment of a component of a metrological apparatus in at least one direction is described which includes: positioning an artefact on a support surface of a turntable of the metrological apparatus so that a measurement surface of the artefact is asymmetric with respect to a rotation axis of the turntable in the at least one direction; using a measurement probe of the measurement instrument to make a first measurement of the measurement surface; rotating the turntable; using the measurement probe of the measurement instrument to make a second measurement of the measurement surface after rotation of the turntable; and determining a correction parameter from the first and second measurements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.